Sintering Innovations for Power Electronics
Conference: PCIM Asia New Delhi - The Agent of Change for the Indian Power Electronics Industry
12/09/2025 - 12/10/2025 at Dr. Ambedkar International Centre, New Delhi, India
doi:10.30420/566677028
Proceedings: PCIM Asia New Delhi
Pages: 7Language: englishTyp: PDF
Authors:
Khaselev, Oscar; Boureghda, Monnir; Socarras, Andres; Barboza, Guilherme; Fenech, Maurizio; Dutt, Gyan; Bhatkal, Ravi
Abstract:
Pressure-sintered silver is the die attach material of choice for high-power SiC MOSFETs in EV inverters. 10-30X improvement (over high-lead solder) in power cycling has been reported, and the solution has been proven in millions of inverters [1-3]. Next, there is a need to improve reliability of power discretes and module-attach for inverter assembly. Eliminating lead-based solders and improving thermal dissipation and mechanical reliability are the drivers. In this work, we present process and reliability data of sintering and soldering commercial power modules to the heat sink. We also share a wafer level process for die attach sintering in discretes.