1
Development of Modularized Electrode in Electro-Kinetic Force Assisted Chemical Mechanical Planarization for Through-Silicon-Via Wafer Planarization
Authors:
Chen, Chao-Chang A.; Xue, Min-Yue; Lin, Yu-Ming; Pu, Wei-Chin W.
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
2
Development of Novel Cleaning Solution for Post Chemical Mechanical Planarization Silicon Wafer
Authors:
Song, Junghwan; Han, Na; Park, Kihong; Yi, Sokho; Kim, Taesung
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
3
Development of Post InGaAs CMP Cleaning Process for sub 10nm Device Application
Authors:
Purushothaman, Muthukrishnan; Choi, In-chan; Kim, Hyun-Tae; Teugels, Lieve; Kim, Tae-Gon; Park, Jin-Goo
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
4
Device pattern impact on optical endpoint detection by interferometry for STI CMP
Authors:
Bourzgui, S.; Roussy, A.; Georges, G.; Faivre, E.; Labory, K.; Allard, A.
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
5
Dummy Gate Amorphous Silicon CMP Using In-situ Profile CLC Endpoint System for Advanced FinFET
Authors:
Tsvetanova, Diana; Iizumi, Takeshi; Ito, Ban; Royere, Gael; Durix, Fabien; Devriendt, Katia; Ong, Patrick; Struyf, Herbert
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
6
Effect of Al2O3 and SiO2 Abrasives on the CMP of Molybdenum using Different Polishing Parameters
Authors:
Kalantzis, Panagiotis; Teugels, Lieve; De Gendt, Stefan
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
7
Effect of colloidal silica particles on subsurface damage of fused silica optics during CMP process
Authors:
Chunli, Zou; Li, Xu; Chengxi, Kang; Xin, Zhang; Guoshun, Pan
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
8
Effect of Corrosion Inhibitor and Non-ionic Surfactant on CMP of Cu/Co Barrier Stack
Authors:
Jiang, Liang; He, Yongyong; Qian, Linmao
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
9
Effect of Deposition Methods on Material Removal Rate During Nickel CMP
Authors:
Wang, Yanni; Teugels, Lieve; Vandersmissen, Kevin; De Gendt, Stefan; Krishnan, Sitaraman; Struyf, Herbert
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
10
Effect of Flow Rate and Concentration on Filtration Efficiency of Colloidal Abrasives
Authors:
Wu, Mia; Lee, James; Wang, Henry; Hsiao, Steven; Shie, Bob; Yang, HJ
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
11
Effect of Guanidine Sulfate on the CMP of Ru in H2O2 Based Slurry
Authors:
Yang, Guang; He, Peng; Qu, Xin-Ping
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
12
Electrochemical study of SiGe in different alkaline chemical formulations
Authors:
Yang, Shenghua; Zhang, Baoguo; Liu, Yuling; Wang, Chenwei
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
13
Evaluation of Competitive Reaction of Various Cu CMP Slurry Components
Authors:
Han, Kwang-Min; Cho, Byoung-Jun; Lee, Jung-Hwan; Ryu, Heon-Yul; Shima, Shohei; Hamada, Satomi; Hiyama, Hirokuni; Park, Jin-Goo
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
14
Evaluation of Polyurethane Pads Properties for Effective Use in Planarization Process
Authors:
Chung, Hyunjae; Shin, Cheolmin; Jin, Yinhua; Kim, Taesung
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
15
High-efficiency Planarization of GaN Wefers by Catalyst-Referred Etching Employing Photoelectrochemical Oxdation
Authors:
Kida, Hideka; Isohashi, Ai; Inada, Tatsuaki; Matsuyama, Satoshi; Sano, Yasuhisa; Yamauchi, Kazuto
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
16
Highly Efficient Cleaning Formulations for Removing Ceria Slurry Residues in Post-CMP Applications
Authors:
Bernatis, Paul; Lin, Jhih-Fong; Tai, Pei-Yu; Lin, Yi-Han; Bai, Chia-Hui; Tseng, Yi-Hao; Kuroda, Akira; Yen, Chi
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
17
Improvement of Material Removal Efficiency by Optimization of Anisotropic Contact of Pad Asperities
Authors:
Suzuki, Norikazu; Oshika, Shingo; Misono, Hirotaka; Hashimoto, Yohei; Yasuda, Hozumi; Mochizuki, Yoshihiro
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
18
Improvement of Ruthenium Polishing Rate by Addition of Guanidinium Ions
Authors:
Wang, Chenwei; Du, Yichen; Zhou, Jianwei; Liu, Yuling
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
19
In situ imaging of local corrosion cells on copper fine wires in solutions
Authors:
Takatoh, Chikako; Ogata, Shoichiro; Kitagawa, Takuya; Okamoto, Takahiro
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology
20
In-line Atomic Resolution Local Nanotopography Variation Metrology for CMP Process
Authors:
Kim, Tae-Gon; Heylen, Nancy; Kim, Soon-Wook; Vandeweyer, Tom; Jo, Ah-Jin; Lee, Ju Suk; Ahn, Byoung-Woon; Cho, Sang-Joon; Park, Sang-il; Irmer, Bernd; Schmidt, Sebastian
Conference:
ICPT 2017 - International Conference on Planarization/CMP Technology