1
3-D Electrothermal Modeling of SiC Multichip Power Modules for a More Accurate Reliability Assessment
Authors:
Race, Salvatore; Stark, Roger; Kovacevic-Badstuebner, Ivana; Nagel, Michel; Ziemann, Thomas; Tsibizov, Alexander; Grossner, Ulrike
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
2
A gate driver for on-line heat-treatment to extend the lifetime of multichip power modules
Authors:
Quemener, Vincent; Le Lesle, Johan; Pichon, Pierre-Yves; Brandelero, Julio Cezar; Degrenne, Nicolas
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
3
A Study of parasitic oscillations in trench IGBT during short-circuit type II based on signal flow graph model
Authors:
Kono, Hiroshi; Omura, Ichiro
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
4
Accelerated Lifetime Testing and Failure Analysis for Advanced Automotive Grade Ceramic Capacitors (MLCC)
Authors:
Dresel, Fabian; Leib, Juergen; Schletz, Andreas; Boettge, Bianca; Klengel, Sandy
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
5
Active Thermal Cycling of Discrete Power Semiconductors for Applications with strong ΔT-Profiles
Authors:
Kostynski, Daniel; Sack, Steffen; Sievers, Markus
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
6
Advanced cooling concept based on standard power modules significantly improves lifetime
Authors:
Buschhorn, Stefan; Mainka, Krzysztof; Vogel, Klaus
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
7
Aging of Insulation Materials under Repetitive Impulse Voltage Stress with high dv/dt
Authors:
Claudi, Albert; Braun, Gerrit; Klengel, Robert; Klengel, Sandy; Zacharias, Peter; Yu, Xiao
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
8
Algorithmic Optimisation of Chip Dimensions and Layout Pattern in Press-Pack IGBT Devices
Authors:
Simpson, Robin; Wang, Yangang; Nicholson, Michael; Bell, Daniel
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
9
AlON gate dielectric and gate trench cleaning for improved reliability of vertical GaN MOSFETs
Authors:
Goncalez Filho, Walter; Borga, Matteo; Geens, Karen; Cingu, Deepthi; Chatterjee, Urmimala; You, Shuzhen; Bakeroot, Benoit; Decoutere, Stefaan; Knaepen, Werner; Arnou, Panagiota; Homm, Pia
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
10
An Embedded Power Section with GaN HEMTs
Authors:
Li, Tianyu; Voigt, Christian; Lindemann, Andreas; Erhardt, Eugen; Boettcher, Lars
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
11
An evaluation of Cu-to-Cu ultrasonic welding bond through thermal cycling
Authors:
De, Meghna; Agyakwa, Pearl A.; Arjmand, Elaheh; Mouawad, Bassem; Neate, Nigel; Steinhoff, Stefan; Johnson, C. Mark
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
12
An Integrated IGBT Module for Dual Inverter Applications
Authors:
Li, Jianfeng; Ma, Yaqing; Dong, Fangfang; Du, Yuekang; Arcillas, Joseph Castillo; Yan, Jiayi
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
13
Artificial Intelligence and Long-term Performance of Power Electronics Systems
Authors:
Zhao, Shuai; Peyghami, Saeed; Gebbran, Daniel; Dragicevic, Tomislav; Wang, Huai; Blaabjerg, Frede
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
14
Automatic Model Generation for PCB-based Power Electronics
Authors:
Ben Hamed, Bahaeddine; Regnat, Guillaume; Lefevre, Guillaume; Buttay, Cyril
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
15
Change in SiC MOSFET body-diode voltage drop in TO-247 packages during inverse-mode and forward-mode power cycling test
Authors:
Singh, Bhanu Pratap; Farjah, Amin; Chaudhury, Khaled Redwan; Norrga, Staffan; Nee, Hans-Peter
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
16
Characterization of a 25V GaN d-HEMT Device through Large Signal Gate Charge Measurements and In-Converter Testing
Authors:
O’Sullivan, Brendan; Fiebig, Norbert; Benkhelifa, Fouad; McCloskey, Paul; O’Mathuna, Cian; O’Driscoll, Seamus
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
17
Chemical Substrate Treatment for Improved Pressureless Silver Sintering Adhesion of Power Electronics Dies
Authors:
Steiner, Felix; Wurst, Helge; Blank, Thomas
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
18
Comparison of Different Methods for the Characterization of Online Junction Temperature of a Gallium-Nitride Power Transistor
Authors:
Sharmaa, Kanuj; Hueckelheim, Jan; Munoz Baron, Kevin; Ruthardt, Johannes; Kallfass, Ingmar
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
19
Condition monitoring and evaluation of Ron degradation during power cycling in switching mode of SiC-Mosfets power modules
Authors:
Ibrahim, Ali; Lallemand, Richard; Khatir, Zoubir; Berkani, Mounira; Ingrosso, Damien
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
20
Cooling Concept and Molding Packaging for PV Module Integrated Micro-Inverters
Authors:
Manthey, Tobias; Ranft, Paul; Friebe, Jens
Conference:
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems