Cover IEC 60749-22:2002
größer

IEC 60749-22:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Circulation Date: 2002-09
Edition: 1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 41 VDE Artno.: 210139

Content

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements.The contents of the corrigendum of August 2003 have been included in this copy.