Cover IEC 60749-19:2003

IEC 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Circulation Date: 2003-02
Edition: 1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 11 VDE Artno.: 210500


Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.