Cover IEC 60749-25:2003

IEC 60749-25:2003

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Circulation Date: 2003-07
Edition: 1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 25 VDE Artno.: 210834


Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.