Cover IEC 60749-14:2003

IEC 60749-14:2003

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Circulation Date: 2003-08
Edition: 1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 27 VDE Artno.: 210962


Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.