Cover IEC 60749-35:2006

IEC 60749-35:2006

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

Circulation Date: 2006-07
Edition: 1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 43 VDE Artno.: 212916


Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.