IEC 60191-6-18:2010/COR1:2010

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Circulation Date: 2010-05
Edition: 1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 1 VDE Artno.: 217245