IEC 60191-6-18:2010/COR2:2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Circulation Date: 2010-07
Edition: 1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 1 VDE Artno.: 217414