IEC 60191-6-17:2011
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Circulation Date:
2011-01
Edition:
1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 53 VDE Artno.: 217763
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.