IEC 60191-6-4:2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Circulation Date:
2003-06
Edition:
1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 32 VDE Artno.: 219482
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.