IEC 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
Circulation Date:
2001-03
Edition:
1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 25 VDE Artno.: 219588
IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.