Cover IEC TR 63378-1:2021

IEC TR 63378-1:2021

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Circulation Date: 2021-12
Edition: 1.0
Language: EN - english
Seitenzahl: 20 VDE Artno.: 250571


IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.