Cover IEC 60749-37:2022 RLV

IEC 60749-37:2022 RLV

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

Circulation Date: 2022-10
Edition: 2.0
Language: EN - english
Seitenzahl: 67 VDE Artno.: 251236


IEC 60749-37:2022 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.