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IEC 60749-15:2020

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

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40.00 € 

IEC 60191-2:1966/AMD21:2020

Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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40.00 € 

IEC 60747-18-2:2020

Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package modules

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115.00 € 

IEC 62779-4:2020

Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope

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115.00 € 

IEC 60747-9:2019

Semiconductor devices - Part 9: Discrete devices - Insulated-gate bipolar transistors (IGBTs)

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330.00 € 

IEC 60747-14-10:2019

Semiconductor devices - Part 14-10: Semiconductor sensors - Performance evaluation methods for wearable glucose sensors

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220.00 € 

IEC 60749-20-1:2019 RLV

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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338.00 € 

IEC 60749-20-1:2019

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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260.00 € 

IEC 60749-18:2019 RLV

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

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195.00 € 

IEC 60749-18:2019

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

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150.00 € 

IEC 60749-17:2019

Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

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40.00 € 

IEC 60191-2:1966/AMD20:2018

Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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75.00 € 

IEC 60191-4:2013/AMD1:2018

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

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75.00 € 

IEC 60191-4:2013+AMD1:2018 CSV (Consolidated Version)

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

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295.00 € 

IEC 60749-13:2018

Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

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75.00 € 

IEC 60191-1:2018

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

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220.00 € 

IEC 60749-26:2018

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

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290.00 € 

IEC 60749-12:2017

Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

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20.00 € 

IEC TR 63133:2017

Semiconductor devices - Scan based ageing level estimation for semiconductor devices

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115.00 € 

IEC 62880-1:2017

Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard

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150.00 €