IEC 60749-15:2020Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
40.00 €
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IEC 60191-2:1966/AMD21:2020Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
40.00 €
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IEC 60747-18-2:2020Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package modules
115.00 €
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IEC 62779-4:2020Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
115.00 €
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IEC 60747-9:2019Semiconductor devices - Part 9: Discrete devices - Insulated-gate bipolar transistors (IGBTs)
330.00 €
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IEC 60747-14-10:2019Semiconductor devices - Part 14-10: Semiconductor sensors - Performance evaluation methods for wearable glucose sensors
220.00 €
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IEC 60749-20-1:2019 RLVSemiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
338.00 €
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IEC 60749-20-1:2019Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
260.00 €
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IEC 60749-18:2019 RLVSemiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
195.00 €
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IEC 60749-18:2019Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
150.00 €
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IEC 60749-17:2019Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
40.00 €
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IEC 60191-2:1966/AMD20:2018Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
75.00 €
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IEC 60191-4:2013/AMD1:2018Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
75.00 €
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IEC 60191-4:2013+AMD1:2018 CSV (Consolidated Version)Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
295.00 €
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IEC 60749-13:2018Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
75.00 €
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IEC 60191-1:2018Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
220.00 €
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IEC 60749-26:2018Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
290.00 €
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IEC 60749-12:2017Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
20.00 €
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IEC TR 63133:2017Semiconductor devices - Scan based ageing level estimation for semiconductor devices
115.00 €
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IEC 62880-1:2017Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard
150.00 €
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