IEC 60749-5:2017Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
40.00 €
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IEC 60749-3:2017Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
40.00 €
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IEC 60749-9:2017Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
40.00 €
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IEC 60749-6:2017Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
20.00 €
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IEC 60749-4:2017Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
40.00 €
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IEC 60191-6-13:2016Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
115.00 €
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IEC 60749-44:2016Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
150.00 €
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IEC 62779-3:2016Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
75.00 €
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IEC 62779-1:2016Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
115.00 €
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IEC 62779-2:2016Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
115.00 €
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IEC 62007-1:2015Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
220.00 €
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IEC 60749-42:2014Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
20.00 €
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IEC 60191-4:2013Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
150.00 €
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IEC 62483:2013Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
260.00 €
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IEC 60191-6-22:2012Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
115.00 €
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IEC 60191-2:1966/AMD19:2012Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
150.00 €
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IEC 60749-27:2006+AMD1:2012 CSV (Consolidated Version)Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
110.00 €
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IEC 60749-27:2006/AMD1:2012Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
10.00 €
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IEC 60191-2:1966/AMD18:2011Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
115.00 €
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IEC 60749-40:2011Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
150.00 €
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