IEC 60191-2:1966/AMD3:2001

Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-6-5:2001

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

IEC 60191-6-8:2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

IEC 60191-2:1966/AMD2:2001

Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-6-6:2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

IEC 60747-16-2:2001

Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers

IEC 60191-2:1966/AMD1:2001

Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-6-3:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

IEC 60191-2Z:2000

Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2Y:2000

Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2X:1999/COR1:2000

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-3:1999

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

IEC 60191-2X:1999

Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2W:1999

Twenty-first supplement

IEC 60191-2V:1998

Twentieth supplement

IEC 60191-2U:1997

Nineteenth supplement

IEC 60191-5:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

IEC 60191-2T:1996

Eighteenth supplement

IEC 60821:1991

VMEbus - Microprocessor system bus for 1 byte to 4 byte data

IEC 60796-1:1990

Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 1: Functional description with electrical and timing specifications