IEC 60749-26:2018Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
290.00 €
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IEC 60749-12:2017Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
20.00 €
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IEC 60749-5:2017Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
40.00 €
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IEC 60749-3:2017Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
40.00 €
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IEC 60749-9:2017Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
40.00 €
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IEC 60749-6:2017Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
20.00 €
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IEC 60749-4:2017Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
40.00 €
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IEC 60749-44:2016Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
150.00 €
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IEC 60749-42:2014Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
20.00 €
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IEC 60749-27:2006+AMD1:2012 CSV (Consolidated Version)Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
110.00 €
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IEC 60749-27:2006/AMD1:2012Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
10.00 €
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IEC 60749-40:2011Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
150.00 €
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IEC 60749-7:2011Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
40.00 €
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IEC 60749-21:2011Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
150.00 €
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IEC 60749-29:2011Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
150.00 €
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IEC 60749-23:2004+AMD1:2011 CSV (Consolidated Version)Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
65.00 €
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IEC 60749-23:2004/AMD1:2011Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
10.00 €
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IEC 60749-19:2003+AMD1:2010 CSV (Consolidated Version)Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
40.00 €
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IEC 60749-32:2002+AMD1:2010 CSV (Consolidated Version)Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
40.00 €
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IEC 60749-34:2010Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
40.00 €
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