IEC 62878-2-603:2025

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

IEC TS 62878-2-10:2024

Device embedding assembly technology - Part 2-10: Design specification for cavity substrate

IEC TR 62878-2-9:2022

Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries

IEC TR 62878-2-8:2021

Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate

IEC 62878-2-602:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

IEC 62878-1:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

IEC 62878-2-5:2019

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

IEC TR 62878-2-7:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

IEC TR 62878-2-2:2015

Device embedded substrate - Part 2-2: Guidelines - Electrical testing

IEC 62878-1-1:2015

Device embedded substrate - Part 1-1: Generic specification - Test methods

IEC TS 62878-2-1:2015

Device embedded substrate - Part 2-1: Guidelines - General description of technology

IEC TS 62878-2-3:2015

Device embedded substrate - Part 2-3: Guidelines - Design guide

IEC TS 62878-2-4:2015

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)