Cover IEC TR 62878-2-7:2019
größer

IEC TR 62878-2-7:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Circulation Date: 2019-03
Edition: 1.0
Language: EN - english
Seitenzahl: 12 VDE Artno.: 247268

Content

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.