Development of Co-Integrated Shape Memory Actuators for Silicon Micro- and Nanomechanics
Conference: ACTUATOR - International Conference and Exhibition on New Actuator Systems and Applications 2021
02/17/2021 - 02/19/2021 at Online
Proceedings: GMM-Fb. 98: ACTUATOR 2021
Pages: 2Language: englishTyp: PDF
Authors:
Li, Zixiong; Arivanandhan, Gowtham; Rastjoo, Sanaz; Fechner, Randy; Kohl, Manfred (Institute of Microstructure Technology, Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany)
Bumke, Lars; Quandt, Eckhard (Institute for Materials Science, Kiel University (CAU), Kiel, Germany)
Abstract:
The unique properties of shape memory alloy (SMA) films like highest work densities up to 107 Jm-3 and favorable downscaling of actuation performance are of special interest for the development of actuators at ultra-small scale. Here, we present a novel approach to combine SMA film deposition and structuring technologies with silicon technology to enable the co-integration of SMA actuators and silicon-on-insulator (SOI) micro- and nanostructures. Double-beam cantilevers are chosen for the actuator layout to enable electro-thermal actuation by Joule heating. The SMA materials under investigation are TiNiCu films deposited by magnetron sputtering. Electrical resistance and deflection characteristics on TiNiCu/Si nanoactuators are presented to demonstrate the feasibility of the fabrication approach.