Highly thermally conductive and integratable circuit carriers based on anodized aluminum

Abstract:
Anodic aluminum oxide is a promising coating material for electronic applications, as it represents an adherent and economically friendly alternative for inorganic insulating layers in high performance electronic substrates, such as insulated metal substrates. Aiming the fabrication of such electronic substrates, two key aspects that must be considered: (i) the robustness against thermomechanical stresses that occur during production as well as operation, and (ii) the possibility to create an adherent selective metallization. A preliminary selection of suitable process parameters regarding anodization was carried out, and a standard metallization process was used for the fabrication of electronic substrates. Thermal stress tests were performed to evaluate these substrates, and a demonstrator was built.