Realization and Mounting of Additively Manufactured 3D Structures on Diced Microsystem Chips using Material Jetting
Conference: MikroSystemTechnik KONGRESS 2025 - Mikroelektronik/Mikrosystemtechnik und ihre Anwendungen – Nachhaltigkeit und Technologiesouveränität
10/27/2025 - 10/29/2025 at Duisburg, Germany
doi:10.30420/456614080
Proceedings: MikroSystemTechnik Kongress 2025
Pages: 5Language: englishTyp: PDF
Authors:
Hauck, Lukas; Knechtel, Roy
Abstract:
This work is about a method of placing and fixing additively manufactured polymer structures on integrated micro systems for prototyping purposes. It describes the realization of an exemplary structure made of UV-photopolymerizable material using the mSLA process, the defined forming of adhesive intermediate layers by material jetting as well as the positioning and mounting of the components using pick & place.