Advanced Heterogeneous System Integration of Chiplets and Quasi-Monolithic Integration

Abstract:
The increasingly higher costs for further node miniaturization in the IC manufacturing process will promote the interconnection of chiplets. The increasing miniaturization of semiconductor structures and the associated increase in technology complexity have led to an enormous increase in the cost of IC production. The idea now is to use different types of IPs that can be used for specific functions. Starting with solutions in the microprocessor sector, chiplet integration technology also offers new opportunities for innovation in the areas of MEMS, RF and optical systems. However, advanced heterogeneous integration is therefore essential for the integration of such chiplets, which goes far beyond the known integration methods for monolithic processes, such as full-chip integration and 2.5D integration. These concepts must be further developed in line with the qualitative and quantitative changes in industry requirements. Special attention is also paid to the expansion of heterogeneous integration to quasi-monolithic integration (QMI) for maximum power density by utilizing back-end-of-line and advanced packaging capabilities. Novel back-end-of-line interface technologies for MEMS, opto/RF chips (III/V RF chips with (Bi)CMOS for frequencies above 100 GHz) to make "hard IP" (IP blocks, not only mapped in a library as in SoC, but actually in-silicon processed for further use) available are also planned, as well as world-leading test concepts and technologies for functionality, quality and yield optimization of heterogeneous integrated systems.