Characterization, testing & reliability for heterogeneous integration of chiplets

Abstract:
The characterization, test and reliability methodology for advanced packaging and heterogeneous integration of electronic components and systems is requesting a holistic approach that combines characterization and testing as well as key innovation to ensure safety and functional reliability. The modular nature of such systems with the wide variety of signal types, amplitudes and frequencies, and with the high integration density creates new topics for research and development. Novel concepts, methods and instrumentation will be developed to tackle these challenges as part of the fabrication pilot line APECS (Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems). The contribution shows technical concepts of particular set-ups, methods for characterization and test and for analysis of reliability issues as well as secure operation.