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41

Fabrication of PCB Embedded 1200V/50A Power Module and Benchmarking with Commercial DBC-based Package

Authors:
Sharma, Ankit Bhushan; Schnur, Johann; Haag, Niko; Kuwan, Thomas; Stogel, Armin; Huesgen, Till
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

42

FEM based enhancement of system lifetime by improvement of the die top connection of power electronic semiconductors

Authors:
Becker, Martin; Hinrich, Andreas; Klein, Andreas; Miric, Anton Z.; Fabian, Benjamin; Schmitt, Wolfgang; Kalajica, Marko
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

43

Ferrite embedding for Power SiPs – a packaging view

Authors:
Thomas, Tina; Schneider-Ramelow, Martin; Hoffmann, Stefan; Becker, Karl-Friedrich; Walter, Hans; Bader, Volker; Braun, Tanja; Hoene, Eckart
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

44

Frequency Optimum of Semiconductor Technologies and State-of-the-Art Magnetic Components on SMPS

Authors:
Reimann, Tobias; Scherf, Marko
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

45

Full SiC Integrated Power Converter Module with Replaceable Build-ing Blocks

Authors:
Aliyu, Attahir Murtala; Castellazzi, Alberto; Lasserrre, Philippe; Delmonte, Nicola; Cova, Paolo
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

46

Grid-Connected Three-Phase H-Bridge Inverter with Level Doubling Network Controlled by Staircase Modulation Techniques

Authors:
Srndovic, Milan; Viatkin, Aleksandr; Grandi, Gabriele
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

47

Highly Reliable Power Modules by Pressureless Sintering

Authors:
Waltrich, Uwe; Bayer, Christoph Friedrich; Zoetl, Stephanie; Tokarski, Adam; Zischler, Sigrid; Schletz, Andreas; Maerz, Martin
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

48

How asymmetric busbar design causes symmetric switching behavior of paralleled IGBT modules

Authors:
Wissen, Matthias; Domes, Daniel; Brekel, Waleri; Yilmaz, Koray
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

49

Identifying the Stray Elements of the Experimental Setup Used in the Semiconductor Datasheets

Authors:
Delhommais, Mylene; Schanen, Jean-Luc; Wurtz, Frederic; Avenas, Yvan; Rigaud, Cecile; Chardon, Sylvain
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

50

Impedance analysis in a co-planar power bus interconnect prototype for low inductance switching

Authors:
Lin, Xi; Li, Jianfeng; Johnson, C. Mark
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

51

Improvement of Power Module System Solders by Directional Solidification

Authors:
Hutzler, Aaron; Oetzel, Christoph; Friker, Emil
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

52

Improving 9-150 kHz EMI Performance of Single-Phase PFC Rectifier

Authors:
Davari, Pooya; Blaabjerg, Frede; Hoene, Eckart; Zare, Firuz
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

53

In-situ condition monitoring system to study the ageing of power semi-conductor devices in photovoltaic inverters

Authors:
Dbeiss, Mouhannad; Avenas, Yvan; Zara, Henri; Dupont, Laurent
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

54

Innovative Reliable Nitride based Power Devices and Applications ‒ The EU Public Funded Project ‘InRel-NPower‘

Authors:
Rittner, Martin; Kessler, Ulrich; Naundorf, Joerg; Kriegel, Kai; Schulz, Martin; Meneghesso, Gaudenzio
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

55

Integrated LED Driver based on 800V Si L-IGBTs

Authors:
Aliyu, Attahir Murtala; Elliott, Alwyn; Pathirana, Vasantha; Udugampola, V. Nishad; Rajaguru, Pushparajah
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

56

Integration Concept for a Traction Inverter with 3D-Printed Embedded Cooling Technology realizing Highest Power Density

Authors:
Schnack, Jasper; Hilper, Dominik; Schuemann, Ulf; Eisele, Ronald; Osterwald, Frank; Beer, Holger; Ebel, Thomas
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

57

Integration solutions for clean and safe switching of high speed devices

Authors:
Schanen, Jean-Luc; Jeannin, Pierre-Olivier
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

58

Interpretation of Power Cycling Data derived from transient Cooling Curves

Authors:
Bayer, Martin; Hartmann, Samuel; Berg, Marianne; Moody, Robert; Paques, Gontran
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

59

Investigation of the usage of a chip integrated sensor to determine junction temperature during power cycling tests

Authors:
Kempiak, Carsten; Lindemann, Andreas; Thal, Eckhard; Idaka, Shiori
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

60

Investigations on the Evolution of Dynamic Ron of GaN Power Transistors during Switching Cycles

Authors:
Elharizi, Malika; Khatir, Zoubir; Lallemand, Richard; Ousten, Jean-Pierre
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems