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81

Reliability Design of Dual Sided Cooled Power Semiconductor Module for Hybrid and Electric Vehicles

Authors:
Wang, Yangang; Li, Yun; Liu, Xuyu; Li, Helong; Dai, Xiaoping; Wu, Yibo; Liu, Guoyou
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

82

Review of Parasitic Minimization Techniques for High Frequency Power Conversion

Authors:
Reusch, David; Lidow, Alex
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

83

Signal Sweeping Technique to Decouple the Influence of Junction Temperature and Bondwire Lift-off in Condition Monitoring for Multichip IGBT Modules

Authors:
Chen, Cuili; Pickert, Volker; Tsimenidis, Charalampos; Lu, Xiang; Al-Greer, Maher; Logenthiran, Thillainathan; Ng, Chong; Jia, Chunjiang
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

84

Silver sinter paste optimized for pressure sintering under air atmosphere on precious and non-precious metal surfaces with high reliable sintered joints

Authors:
Chew, Ly May; Schmitt, Wolfgang; Nachreiner, Jens; Gunst, Stefan
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

85

Simulation of the Thermal Transient Behaviour of Silicon Carbide Modules Using Liquid Convection Cooling

Authors:
Mueter, Ulf; Radvan, Jens; Richter, Stefan; Hoffmann, Klaus F.
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

86

SMPS electromagnetic noise in System-on-Chip: Resonant frequency and amplitude dependencies

Authors:
Feltrin, Eric; Chesneau, David; Vollaire, Christian
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

87

Solder layer degradation measurement for SiC-MOSFET Modules under accelerated power cycling conditions

Authors:
Luo, Haoze; Iannuzzo, Francesco; Blaabjerg, Frede
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

88

Suppression of Electromagnetic Interference using Multi-Stage Integrated Filtering with Screening and Partitioning

Authors:
Zhang, Zhe; Johnson, C. Mark
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

89

Surge Current Capability of IGBTs Used in Low Voltage DC/AC Hybrid Circuit Breaker

Authors:
Askan, Kenan; Bartonek, Michael; Sobe, Klaus
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

90

Switching characteristics of low inductance SiC module with integrated capacitors for aircraft applications

Authors:
Cougo, Bernardo; Sathler, Hans; Riva, Raphael
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

91

Test Strategies in Industrial Companies

Authors:
Rimestad, Lars
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

92

The M-Shunt Structure Applied to Printed Circuit Boards

Authors:
Boedeker, Christian; Adelmund, Melanie; Kaminski, Nando
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

93

The Promise of GaN in Light of Future Requirements for Power Electronics

Authors:
Deboy, Gerald; Kasper, Matthias; Garcia, Alfredo Medina; Schlenk, Manfred
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

94

Thermal and thermo-mechanical design of an integrated substrate and heat sink for planar power module

Authors:
Li, Jianfeng; Lin, Xi; Dai, Jingru; Mouawad, Bassem; Johnson, Christopher Mark; Zhang, Hui; Liu, Xuejian; Huang, Zhengren
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

95

Thermal Characteristic Evaluation and Transient Thermal Analysis of Next-generation SiC Power Module at 250 °C

Authors:
Imakiire, Akihiro; Kozako, Masahiro; Hikta, Masayuki; Inagaki, Masakazu; Iizuka, Tomonori; Narimatsu, Hiroaki; Sato, Nobuaki; Shimizu, Koji; Ueda, Kazutoshi; Sugiura, Kazuhiko; Tsuruta, Kazuhiro; Iida, Makio; Toda, Keiji
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

96

Thermistor Die for Power Module Applications

Authors:
Schuurman, Sophie; Mattens, Erik; Beneden, Bruno Van; Mattiuzzo, Emilio; Turnaturi, Marcello
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

97

Thermo-mechanical stress and deformation behavior of joined semiconductor devices using different die attach technologies

Authors:
Naumann, Falk; Lorenz, Georg; Bernasch, Michael; Boettge, Bianca; Ebensperger, Christina; Oehling, Stefan
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

98

Towards Wafer Level 3D Power Integration

Authors:
Charbonnier, Jean; Rat, Venceslass; Carvalho, Hamilton de; Bergogne, Dominique; Siegert, Joerg; Pressel, Klaus
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

99

Transfer molding for power semiconductor modules

Authors:
Schuderer, Juergen; Lindstroem, Viktor; Liu, Chunlei; Mohn, Fabian
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

100

Trends in SiC MOSFET Threshold Voltage and ON-Resistance Measurements from Thermal Cycling and Electrical Switching Stresses

Authors:
Kozak, Joseph P.; DeVoto, Douglas J.; Major, Joshua J.; Ngo, Khai D.T.
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems