1
3D FEM simulation of stress evolution induced during sintering in silicon-ceramic composite substrates
Authors:
Salimitari, Parastoo; Guenther-Mueller, Sarah; Strehle, Steffen
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
2
3D FEM simulation of stress evolution induced during sintering in silicon-ceramic composite substrates
Authors:
Salimitari, Parastoo; Guenther-Mueller, Sarah; Strehle, Steffen
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
3
A Bistable Actuator Based on Antagonistic Buckling SMA Beams
Authors:
Chen, Xi; Bumke, Lars; Quandt, Eckhard; Kohl, Manfred
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
4
A microfluidic-chip-based system for the determination of nutrient ion concentrations in hydroponic solutions by means of ion-selective electrodes (ISEs)
Authors:
Klotzbuecher, Thomas; Komorek, Mathis; Magomajew, Juri; Gransee, Rainer
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
5
A novel method to characterize the correlation between gas diffusion and sodium contamination of anodic bonding
Authors:
Zhang, Yucheng; Solazzi, Francesco; Schiffer, Michael; Schreiber, Kai; Cselyuszka, Norbert; Andrianov, Nikolai; Sorschag, Kurt; Aschauer, Elmar; Lang, Klaus-Dieter
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
6
Accuracies/Repeatabilities of Airborne (C)MUT Characterization
Authors:
Koeble, S.; Koch, S. G.
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
7
Additive Fertigung von modifizierten SiCN-Keramiken hergestellt aus präkeramischen Polymeren
Authors:
Qazzazie-Hauser, A.; Honnef, K.; Hanemann, T.
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
8
Additive Fertigung von Ti6Al4V-Bauteilen für Anwendungen in der Medizintechnik
Authors:
Hanemann, T.; Antusch, S.; Nötzel, D.; Eickhoff, R.
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
9
An Enhancement of the Unscented Transform for Efficiently Estimating Statistical Measures and Sensitivity Indices
Authors:
Marolt, Kevin; Sautter, Michael; Northemann, Thomas
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
10
Analysis of the Coupling Mechanism between Airborne MEMS Ultra-sonic Transducers and Ultrasonic Horns
Authors:
Bosetti, Gabriele; Hofstetter-Spona, Stefan; Schrag, Gabriele
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
11
Application of Mathematical Inverse Analysis in MEMS Testing
Authors:
Mueller, Juergen; Heringhaus, Monika; Messner, Dominik; Northemann, Thomas
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
12
Automatic wafer probing of photonic integrated circuits with thermal tuning and permanent trimming functions
Authors:
Lipka, Timo; Vermeer, Matthias L.; Rennpferdt, Lukas; Alhareeb, Nadeem K.; Gomberg, I.; Trieu, Hoc Khiem
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
13
Big Data Analytics as a step-change for MEMS Development and Manufacturing
Authors:
Bierwagen, Katharina; Klein, Carsten; Markanday, Akshay; Braun, Markus; Heringhaus, Monika
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
14
Bistable Actuation Based on TiNiHf/Si Shape Memory Nanoactuators
Authors:
Li, Zixiong; Arivanandhan, Gowtham; Curtis, Sabrina M.; Quandt, Eckhard; Kohl, Manfred
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
15
Bovine Oocyte Characterization by Microfluidic Aspiration-Assisted Electrical Impedance Spectroscopy
Authors:
Cao, Yuan; Fries, Ann-Selina; Granacher, Olav; Floehr, Julia; Wrenzycki, Christine; Schnakenberg, Uwe
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
16
Cantilever Free Magnetic Actuation for Multistable Vertical Displacement
Authors:
Weber, Pascal M.; Schuetz, Arwed; Bechtold, Tamara; Wallrabe, Ulrike
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
17
Ceramic Multilayer Technology As Integration Platform And Interposer Technology
Authors:
Goldberg, A.; Ziesche, S.; Ihle, M.; Pandey, P.; Manhica, B.; Reinhardt, K.; Koerner, S.
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
18
Challenges in Realizing Silver Sintered Flip-Chip Interconnects for High Temperature Sensor Systems
Authors:
Raemer, Olaf; Weber, Constanze; Hutter, Matthias; Spanier, Malte; Ostmann, Andreas; Schneider-Ramelow, Martin
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
19
Characterization of TEOS-based SiO2 for integrated photonics
Authors:
Vermeer, Matthias L.; Trieu, Hoc Khiem; Lipka, Timo
Conference:
MikroSystemTechnik Kongress 2023 - Kongress
20
Concept for a MEMS-based GC Chip as a Part of an Easy-to-Use Handheld System
Authors:
Graf, Alexander; Hild, Olaf R.; Zeh, Gina; Sauerwald, Tilman; Buecking, Mark
Conference:
MikroSystemTechnik Kongress 2023 - Kongress