Display
Order by
Page 4 of 4

61

Thermo-mechanical Stress Analysis for Planar Metallization in Integrated Power Electronics Modules

Authors:
Zhu, N.; Wyk, J. D. van; Liang, Z. X.
Conference:
CIPS 2006 - 4th International Conference on Integrated Power Systems

62

Time and spatial resolved detection of power device failures during wire bonding

Authors:
Siepe, Dirk; Bayerer, Reinhold
Conference:
CIPS 2006 - 4th International Conference on Integrated Power Systems

63

Towards an integrated inverter based on lateral JFET SiC

Authors:
Gié, J.; Lazar, M.; Planson, D.; Bergogne, D.; Bevilacqua, P.; Allard, B.; M'Rad, S.
Conference:
CIPS 2006 - 4th International Conference on Integrated Power Systems