DIN EN 60068-2-69VDE 0468-2-69Berichtigung 1:2018-05
Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
(IEC 60068-2-69:2017/COR1:2018); German version EN 60068-2-69:2017/AC:2018-03 Class/Status:
VDE Art. No.: 0400294
This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. This Corrigendum replaces Table 2 - Maximum limits of solder bath contaminants.
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