Cover DIN EN 60068-2-58 VDE 0468-2-58:2018-09
larger

DIN EN 60068-2-58 VDE 0468-2-58:2018-09

Environmental testing

Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

(IEC 60068-2-58:2015 + A1:2017); German version EN 60068-2-58:2015 + A1:2018
Class/Status: Standard, valid
Released: 2018-09
VDE Art. No.: 0400305

Contents (only German)

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD).
This document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

This Document is related to the following Topics (in bold):

19 TESTING
19.020 Prüfbedingungen und Prüfverfahren im Allgemeinen
19.040 Environmental testing
19.080 Electrical and electronic testing
19.100 Non-destructive testing

Click on the appropriate Subject Area Link to display all valid Documents or use the Standards Search.