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DIN EN IEC 60068-2-83 VDE 0468-2-83:2026-05

Environmental testing

Part 2-83: Tests – Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

(IEC 60068-2-83:2025); German version EN IEC 60068-2-83:2025
Class/Status: Standard, valid
Released: 2026-05
VDE Art. No.: 0400765

Note: You can pre-order this document (delivery subject to availability). Valid from 2026-05-01.

This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass – fail purposes. NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

This Document is related to the following Topics (in bold):

19 TESTING
19.020 Prüfbedingungen und Prüfverfahren im Allgemeinen
19.040 Environmental testing
19.080 Electrical and electronic testing
19.100 Non-destructive testing

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