Standard:
DIN EN IEC 63244-1 VDE 0884-244-1:2023-11Semiconductor devices – Semiconductor devices for wireless power transfer and charging Part 1: General requirements and specifications |
Standard:
DIN EN IEC 62435-9 VDE 0884-135-9:2023-09Electronic components – Long-term storage of electronic semiconductor devices Part 9: Special cases |
Standard:
DIN EN IEC 62435-8 VDE 0884-135-8:2022-11Electronic components – Long-term storage of electronic semiconductor devices Part 8: Passive electronic devices |
Standard:
DIN EN IEC 62435-7 VDE 0884-135-7:2022-10Electronic components – Long-term storage of electronic semiconductor devices Part 7: Micro-electromechanical devices |
Standard:
DIN EN IEC 62435-3 VDE 0884-135-3:2022-05Electronic components – Long-term storage of electronic semiconductor devices Part 3: Data |
Standard:
DIN EN IEC 60747-5-5 VDE 0884-5:2021-10Semiconductor devices Part 5-5: Optoelectronic devices – Photocouplers |
Standard:
DIN EN IEC 60747-17 VDE 0884-17:2021-10Semiconductor devices Part 17: Magnetic and capacitive coupler for basic and reinforced insulation |
Standard:
DIN EN IEC 60749-17 VDE 0884-749-17:2019-11Semiconductor devices – Mechanical and climatic test methods Part 17: Neutron irradiation |
Standard:
DIN EN IEC 62435-4 VDE 0884-135-4:2019-05Electronic components – Long-term storage of electronic semiconductor devices Part 4: Storage |
Standard:
DIN EN IEC 62435-6 VDE 0884-135-6:2019-04Electronic components – Long-term storage of electronic semiconductor devices Part 6: Packaged or finished devices |
Standard:
DIN EN IEC 62969-4 VDE 0884-69-4:2019-03Semiconductor devices – Semiconductor interface for automotive vehicles Part 4: Evaluation method of data interface for automotive vehicle sensors |
Standard:
DIN EN IEC 62969-3 VDE 0884-69-3:2018-12Semiconductor devices – Semiconductor interface for automotive vehicles Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors |
Standard:
DIN EN IEC 60749-26 VDE 0884-749-26:2018-10Semiconductor devices – Mechanical and climatic test methods Part 26: Electrostatic discharge (ESD) sensitivity testing – Human body model (HBM) |
Standard:
DIN EN IEC 62969-2 VDE 0884-69-2:2018-09Semiconductor devices – Semiconductor interface for automotive vehicles Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors |
Standard:
DIN EN IEC 62969-1 VDE 0884-69-1:2018-08Semiconductor devices – Semiconductor interface for automotive vehicles Part 1: General requirements of power interface for automotive vehicle sensors |
Standard:
DIN EN 60749-28 VDE 0884-749-28:2018-02Semiconductor devices – Mechanical and climatic test methods Part 28: Electrostatic discharge (ESD) sensitivity testing – Charged device model (CDM) – Device level |
Standard:
DIN EN 62435-1 VDE 0884-135-1:2017-10Electronic components – Long-term storage of electronic semiconductor devices Part 1: General |
Standard:
DIN EN 62435-2 VDE 0884-135-2:2017-10Electronic components – Long-term storage of electronic semiconductor devices Part 2: Deterioration mechanisms |
Standard:
DIN EN 62435-5 VDE 0884-135-5:2017-10Electronic components – Long-term storage of electronic semiconductor devices Part 5: Die and wafer devices |
Standard:
DIN EN 62779-3 VDE 0884-79-3:2017-03Semiconductor devices – Semiconductor interface for human body communication Part 3: Functional type and its operational conditions |