E DIN EN IEC 60749-26 VDE 0884-749-26:2025-10

Semiconductor devices – Mechanical and climatic test methods

Part 26: Electrostatic discharge (ESD) sensitivity testing – Human body model (HBM)

E DIN EN IEC 60749-7 VDE 0884-749-7:2025-04

Semiconductor devices – Mechanical and climatic test methods

Part 7: Internal moisture content measurement and the analysis of other residual gases

E DIN EN IEC 60749-21 VDE 0884-749-21:2025-04

Semiconductor devices – Mechanical and climatic test methods

Part 21: Solderability

E DIN EN IEC 60749-24 VDE 0884-749-24:2025-04

Semiconductor devices – Mechanical and climatic test methods

Part 24: Accelerated moisture resistance – Unbiased HAST

DIN EN IEC 60749-28 VDE 0884-749-28:2024-12

Semiconductor devices – Mechanical and climatic test methods

Part 28: Electrostatic discharge (ESD) sensitivity testing – Charged device model (CDM) – device level

An english translation of this document is available.

DIN EN IEC 60749-5 VDE 0884-749-5:2024-09

Semiconductor devices – Mechanical and climatic test methods

Part 5: Steady-state temperature humidity bias life test

An english translation of this document is available.

DIN EN IEC 63244-1 VDE 0884-244-1:2023-11

Semiconductor devices – Semiconductor devices for wireless power transfer and charging

Part 1: General requirements and specifications

An english translation of this document is available.

DIN EN IEC 62435-9 VDE 0884-135-9:2023-09

Electronic components – Long-term storage of electronic semiconductor devices

Part 9: Special cases

An english translation of this document is available.

DIN EN IEC 62435-8 VDE 0884-135-8:2022-11

Electronic components – Long-term storage of electronic semiconductor devices

Part 8: Passive electronic devices

DIN EN IEC 62435-7 VDE 0884-135-7:2022-10

Electronic components – Long-term storage of electronic semiconductor devices

Part 7: Micro-electromechanical devices

DIN EN IEC 62435-3 VDE 0884-135-3:2022-05

Electronic components – Long-term storage of electronic semiconductor devices

Part 3: Data

DIN EN IEC 60747-5-5 VDE 0884-5:2021-10

Semiconductor devices

Part 5-5: Optoelectronic devices – Photocouplers

DIN EN IEC 60747-17 VDE 0884-17:2021-10

Semiconductor devices

Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

DIN EN IEC 60749-17 VDE 0884-749-17:2019-11

Semiconductor devices – Mechanical and climatic test methods

Part 17: Neutron irradiation

DIN EN IEC 62435-4 VDE 0884-135-4:2019-05

Electronic components – Long-term storage of electronic semiconductor devices

Part 4: Storage

DIN EN IEC 62435-6 VDE 0884-135-6:2019-04

Electronic components – Long-term storage of electronic semiconductor devices

Part 6: Packaged or finished devices

DIN EN IEC 62969-4 VDE 0884-69-4:2019-03

Semiconductor devices – Semiconductor interface for automotive vehicles

Part 4: Evaluation method of data interface for automotive vehicle sensors

DIN EN IEC 62969-3 VDE 0884-69-3:2018-12

Semiconductor devices – Semiconductor interface for automotive vehicles

Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors

DIN EN IEC 60749-26 VDE 0884-749-26:2018-10

Semiconductor devices – Mechanical and climatic test methods

Part 26: Electrostatic discharge (ESD) sensitivity testing – Human body model (HBM)

DIN EN IEC 62969-2 VDE 0884-69-2:2018-09

Semiconductor devices – Semiconductor interface for automotive vehicles

Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors