Cover IEC 61188-6-1:2021
größer

IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Circulation Date: 2021-02
Edition: 1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 63 VDE Artno.: 249690

Content

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.