IEC 62878-2-603:2025

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

IEC 60194-2:2025

Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies

IEC 61188-6-3:2024

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

IEC 61189-2-809:2024

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

IEC TR 60068-3-82:2024

Environmental testing - Part 3-82: Supporting documentation and guidance - Confirmation of the performance of whisker test method

IEC 62529:2024

Standard for Signal and Test Definition

IEC 61189-2-808:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

IEC 61189-2-805:2024

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

IEC 61189-2-720:2024

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance

IEC 61523-4:2023/COR1:2024

Corrigendum 1 - Delay and power calculation standards - Part 4: Design and Verification of Low-Power, Energy-Aware Electronic Systems

IEC TR 60068-3-15:2024

Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering

IEC TR 61760-5-1:2024

Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components

IEC TS 62878-2-10:2024

Device embedding assembly technology - Part 2-10: Design specification for cavity substrate

IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

IEC 63215-2:2023

Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices

IEC 63501-2416:2023

Power Modeling to Enable System Level Analysis

IEC 63504-2804:2023

Software-Hardware Interface for Multi-Many-Core

IEC 61523-1:2023

Delay and power calculation standards - Part 1: Integrated Circuit (IC) Open Library Architecture (OLA)

IEC 61523-4:2023

Delay and power calculation standards - Part 4: Design and Verification of Low-Power, Energy-Aware Electronic Systems

IEC 61691-1-1:2023

Behavioural languages - Part 1-1: VHDL Language Reference Manual