Display
order by
Page 1 of 7

IEC 62878-1:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

102.70 € 

IEC 62878-2-5:2019

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

277.29 € 

IEC TR 61189-5-506:2019

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

143.79 € 

IEC 62899-204:2019

Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers

143.79 € 

IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

246.48 € 

IEC TR 62878-2-7:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

71.89 € 

IEC 62899-202-3:2019

Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method

71.89 € 

IEC 62899-201:2016/AMD1:2018

Amendment 1 - Printed electronics - Part 201: Materials - Substrates

71.89 € 

IEC 62899-201:2016+AMD1:2018 CSV (Consolidated Version)

Printed electronics - Part 201: Materials - Substrates

410.80 € 

IEC 62899-202-5:2018

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

71.89 € 

IEC 62899-403-1:2018

Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine

143.79 € 

IEC 61189-2-630:2018

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures – Moisture absorption after pressure vessel conditioning

20.54 € 

IEC 61249-2-45:2018

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

143.79 € 

IEC 61249-2-46:2018

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

143.79 € 

IEC 61249-2-47:2018

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

143.79 € 

IEC 60194-2:2017

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

246.48 € 

IEC 61189-5-503:2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

143.79 € 

IEC 61188-7:2017

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

102.70 € 

IEC TR 61189-3-914:2017

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

143.79 € 

IEC 62899-401:2017

Printed electronics - Part 401: Printability - Overview

41.08 €