IEC 61189-2-805:2024Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
40.00 €
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IEC 62899-202-8:2024Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials
80.00 €
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IEC 61189-2-720:2024Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
40.00 €
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IEC TS 62878-2-10:2024Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
40.00 €
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IEC 63251:2023Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
150.00 €
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IEC 61189-2-804:2023Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
20.00 €
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IEC 62899-202-9:2023Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
80.00 €
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IEC 61189-2-801:2023Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
40.00 €
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IEC 61189-2-803:2023Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
20.00 €
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IEC 61249-6-3:2023Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
150.00 €
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IEC TR 61191-9:2023Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
345.00 €
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IEC 61249-2-51:2023Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
115.00 €
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IEC PAS 61191-10:2022Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
425.00 €
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IEC TR 62878-2-9:2022Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
80.00 €
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IEC 61189-2-501:2022Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
80.00 €
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IEC 62899-202-4:2021Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
150.00 €
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IEC TR 62899-402-4:2021Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
115.00 €
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