IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
Circulation Date:
2021-09
Edition:
1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 17 VDE Artno.: 250255
IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).