IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
Circulation Date:
2023-07
Edition:
1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 16 VDE Artno.: 252030
IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).