IEC 61189-2-804:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Circulation Date:
2023-08
Edition:
1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 16 VDE Artno.: 252096
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.