IEC 61189-3-302:2025
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Circulation Date:
2025-10
Edition:
1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 34 VDE Artno.: 255549
IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.