IEC 60749-37:2022Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
150.00 €
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IEC 60749-37:2022 RLVSemiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
195.00 €
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IEC 62007-1:2015/AMD1:2022Amendment 1 - Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
10.00 €
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IEC 62007-1:2015+AMD1:2022 CSV (Consolidated Version)Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
295.00 €
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IEC 60747-5-4:2022Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
220.00 €
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IEC 60749-10:2022Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
75.00 €
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IEC 60749-28:2022Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
260.00 €
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IEC 60749-28:2022 RLVSemiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
338.00 €
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IEC TR 63378-1:2021Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
115.00 €
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IEC 60749-39:2021Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
75.00 €
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IEC 60749-39:2021 RLVSemiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
98.00 €
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IEC 63287-1:2021Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
260.00 €
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IEC 60747-14-11:2021Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
150.00 €
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IEC 60749-20:2020Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
185.00 €
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IEC 60749-20:2020 RLVSemiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
241.00 €
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IEC 60749-30:2020Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
75.00 €
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IEC 60749-30:2020 RLVSemiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
98.00 €
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IEC 60749-41:2020Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
150.00 €
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IEC 60747-5-5:2020Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
290.00 €
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IEC 60749-15:2020 RLVSemiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
52.00 €
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