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IEC 60749-7:2011

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

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40.00 € 

IEC 60191-6-12:2011

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

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115.00 € 

IEC 60749-21:2011

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

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150.00 € 

IEC 60749-29:2011

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

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150.00 € 

IEC 60749-23:2004+AMD1:2011 CSV (Consolidated Version)

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

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65.00 € 

IEC 60191-6-17:2011

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

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185.00 € 

IEC 60747-14-4:2011

Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers

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360.00 € 

IEC 60749-23:2004/AMD1:2011

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

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10.00 € 

IEC 60749-19:2003+AMD1:2010 CSV (Consolidated Version)

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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40.00 € 

IEC 60749-32:2002+AMD1:2010 CSV (Consolidated Version)

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

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40.00 € 

IEC 60749-34:2010

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

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40.00 € 

IEC 60191-6-20:2010

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

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40.00 € 

IEC 60191-6-21:2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

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75.00 € 

IEC 60747-1:2006+AMD1:2010 CSV (Consolidated Version)

Semiconductor devices - Part 1: General

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370.00 € 

IEC 60749-19:2003/AMD1:2010

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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10.00 € 

IEC 60749-32:2002/AMD1:2010

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

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10.00 € 

IEC 60191-6-18:2010/COR2:2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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0.00 € 

IEC 60191-6-18:2010/COR1:2010

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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0.00 € 

IEC 62415:2010

Semiconductor devices - Constant current electromigration test

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40.00 € 

IEC 60747-1:2006/AMD1:2010

Amendment 1 - Semiconductor devices - Part 1: General

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10.00 €