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IEC 60191-2:1966/AMD18:2011

Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

115.00 € 

IEC 60749-40:2011

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

150.00 € 

IEC 60749-7:2011

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

40.00 € 

IEC 60191-6-12:2011

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

115.00 € 

IEC 60749-21:2011

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

150.00 € 

IEC 60749-29:2011

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

150.00 € 

IEC 60749-23:2004+AMD1:2011 CSV (Consolidated Version)

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

65.00 € 

IEC 60191-6-17:2011

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

190.00 € 

IEC 60747-14-4:2011

Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers

375.00 € 

IEC 60749-23:2004/AMD1:2011

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

10.00 € 

IEC 60749-19:2003+AMD1:2010 CSV (Consolidated Version)

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

40.00 € 

IEC 60749-32:2002+AMD1:2010 CSV (Consolidated Version)

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

40.00 € 

IEC 60749-34:2010

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

40.00 € 

IEC 60191-6-20:2010

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

40.00 € 

IEC 60191-6-21:2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

80.00 € 

IEC 60747-1:2006+AMD1:2010 CSV (Consolidated Version)

Semiconductor devices - Part 1: General

385.00 € 

IEC 60749-19:2003/AMD1:2010

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

10.00 € 

IEC 60749-32:2002/AMD1:2010

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

10.00 € 

IEC 60191-6-18:2010/COR2:2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

0.00 € 

IEC 60191-6-18:2010/COR1:2010

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

0.00 €