IEC 62483:2013

Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

IEC 60191-6-22:2012

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

IEC 60191-2:1966/AMD19:2012

Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60749-27:2006+AMD1:2012 CSV (Consolidated Version)

Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

IEC 60749-27:2006/AMD1:2012

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

IEC 60191-2:1966/AMD18:2011

Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60749-40:2011

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

IEC 60749-7:2011

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

IEC 60191-6-12:2011

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

IEC 60749-21:2011

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

IEC 60749-29:2011

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

IEC 60749-23:2004+AMD1:2011 CSV (Consolidated Version)

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

IEC 60191-6-17:2011

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

IEC 60747-14-4:2011

Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers

IEC 60749-23:2004/AMD1:2011

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

IEC 60749-19:2003+AMD1:2010 CSV (Consolidated Version)

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

IEC 60749-32:2002+AMD1:2010 CSV (Consolidated Version)

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

IEC 60749-34:2010

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

IEC 60191-6-20:2010

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

IEC 60191-6-21:2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)