IEC 60749-7:2011Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
40.00 €
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IEC 60191-6-12:2011Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
115.00 €
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IEC 60749-21:2011Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
150.00 €
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IEC 60749-29:2011Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
150.00 €
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IEC 60749-23:2004+AMD1:2011 CSV (Consolidated Version)Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
65.00 €
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IEC 60191-6-17:2011Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
185.00 €
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IEC 60747-14-4:2011Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
360.00 €
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IEC 60749-23:2004/AMD1:2011Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
10.00 €
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IEC 60749-19:2003+AMD1:2010 CSV (Consolidated Version)Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
40.00 €
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IEC 60749-32:2002+AMD1:2010 CSV (Consolidated Version)Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
40.00 €
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IEC 60749-34:2010Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
40.00 €
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IEC 60191-6-20:2010Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
40.00 €
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IEC 60191-6-21:2010Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
75.00 €
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IEC 60747-1:2006+AMD1:2010 CSV (Consolidated Version)Semiconductor devices - Part 1: General
370.00 €
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IEC 60749-19:2003/AMD1:2010Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
10.00 €
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IEC 60749-32:2002/AMD1:2010Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
10.00 €
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IEC 60191-6-18:2010/COR2:2010Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
0.00 €
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IEC 60191-6-18:2010/COR1:2010Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
0.00 €
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