IEC 60191-6-16:2007

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

IEC 60749-35:2006

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

IEC 60749-27:2006

Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

IEC 60191-2:1966/AMD13:2006

Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2:1966/AMD14:2006

Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2:1966/AMD15:2006

Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2:1966/AMD12:2006

Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60747-1:2006

Semiconductor devices - Part 1: General

IEC 60191-2:1966/AMD11:2004

Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2:1966/AMD10:2004

Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60749-33:2004

Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

IEC 60749-24:2004

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

IEC 60749-23:2004

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

IEC 60191-2:1966/AMD9:2003

Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-6-10:2003

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

IEC 60749-11:2002/COR2:2003

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

IEC 60749-22:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

IEC 60749-31:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

IEC 60749-32:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

IEC 60749-1:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General