IEC 60747-1:2006

Semiconductor devices - Part 1: General

IEC 60191-2:1966/AMD11:2004

Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2:1966/AMD10:2004

Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60749-33:2004

Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

IEC 60749-24:2004

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

IEC 60749-23:2004

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

IEC 60191-2:1966/AMD9:2003

Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-6-10:2003

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

IEC 60749-11:2002/COR2:2003

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

IEC 60749-22:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

IEC 60749-31:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

IEC 60749-32:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

IEC 60749-1:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General

IEC 60749-2:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure

IEC 60749-8:2002/COR2:2003

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

IEC 60749-14:2003

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

IEC 60749-25:2003

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

IEC 60191-2:1966/AMD8:2003

Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

IEC 60191-6-4:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

IEC 60749-8:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing