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61

Reliability of Silver Sintering on DBC and DBA Substrates for Power Electronic Applications

Authors:
Kraft, Silke; Schletz, Andreas; März, Martin
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

62

Reliable Integration of Double-Sided Cooled Stacked Power Switches based on 70 µm Thin IGBTs and Diodes

Authors:
Li, J. F.; Castellazzi, A.; Solomon, A.; Johnson, C. M.
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

63

Scalable High Insulation Power Supply for Medium Voltage Power Converters

Authors:
Aizpuru, Iosu; Canales, Jose María; Fernández, Jesus
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

64

Separating Failure Modes in Power Cycling Tests

Authors:
Schmidt, Ralf; Scheuermann, Uwe
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

65

SiC and GaN Devices - Competition or Coexistence?

Authors:
Kaminski, Nando; Hilt, Oliver
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

66

SiC Device and Power Module Technologies for Environmentally Friendly Vehicles

Authors:
Hamada, Kimimori
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

67

Sinter materials for broad process windows in DCB packages - concepts and results

Authors:
Schmitt, Wolfgang; Fritzsche, Sebastian; Thomas, Muriel
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

68

Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry

Authors:
Wereszczak, Andrew A.; Vuono, Daniel J.; Liang, Zhenxian; Fox, Ethan E.
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

69

Stacked substrates for high voltage applications

Authors:
Hohlfeld, Olaf; Bayerer, R.; Hunger, Th.; Hartung, H.
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

70

System Approach for Reliability of Low-power Power Electronics; How to Break Down into Their Constructed Parts

Authors:
Tarashioon, S.; Tarashioon, S.; Driel, W. D. van; Zhang, G. Q.
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

71

The performance of the multilevel converter topologies for PV inverter

Authors:
Kashihara, Yugo; Itoh, Jun-ichi
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

72

Thermal Management Concepts for Power Sandwich Industrial Drive

Authors:
Josifovic, I.; Popovic-Gerber, J.; Ferreira, J. A.
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

73

Thermal Networks for Time-Variant Cooling Systems: Modeling Approach and Accuracy Requirements for Lifetime Prediction

Authors:
Gradinger, Thomas; Riedel, Gernot
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

74

Thermo mechanical Reliability of Low-temperature Low-pressure Die Bonding Using Thin Ag Flake Pastes

Authors:
Sakamoto, Soichi; Suganuma, Katuaki
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems

75

Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique

Authors:
Li, Jiping; Ngo, Khai D. T.; Lu, Guo-Quan; Xie, Huikai
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems