61
Reliability of Silver Sintering on DBC and DBA Substrates for Power Electronic Applications
Authors:
Kraft, Silke; Schletz, Andreas; März, Martin
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
62
Reliable Integration of Double-Sided Cooled Stacked Power Switches based on 70 µm Thin IGBTs and Diodes
Authors:
Li, J. F.; Castellazzi, A.; Solomon, A.; Johnson, C. M.
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
63
Scalable High Insulation Power Supply for Medium Voltage Power Converters
Authors:
Aizpuru, Iosu; Canales, Jose María; Fernández, Jesus
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
64
Separating Failure Modes in Power Cycling Tests
Authors:
Schmidt, Ralf; Scheuermann, Uwe
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
65
SiC and GaN Devices - Competition or Coexistence?
Authors:
Kaminski, Nando; Hilt, Oliver
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
66
SiC Device and Power Module Technologies for Environmentally Friendly Vehicles
Authors:
Hamada, Kimimori
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
67
Sinter materials for broad process windows in DCB packages - concepts and results
Authors:
Schmitt, Wolfgang; Fritzsche, Sebastian; Thomas, Muriel
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
68
Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry
Authors:
Wereszczak, Andrew A.; Vuono, Daniel J.; Liang, Zhenxian; Fox, Ethan E.
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
69
Stacked substrates for high voltage applications
Authors:
Hohlfeld, Olaf; Bayerer, R.; Hunger, Th.; Hartung, H.
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
70
System Approach for Reliability of Low-power Power Electronics; How to Break Down into Their Constructed Parts
Authors:
Tarashioon, S.; Tarashioon, S.; Driel, W. D. van; Zhang, G. Q.
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
71
The performance of the multilevel converter topologies for PV inverter
Authors:
Kashihara, Yugo; Itoh, Jun-ichi
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
72
Thermal Management Concepts for Power Sandwich Industrial Drive
Authors:
Josifovic, I.; Popovic-Gerber, J.; Ferreira, J. A.
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
73
Thermal Networks for Time-Variant Cooling Systems: Modeling Approach and Accuracy Requirements for Lifetime Prediction
Authors:
Gradinger, Thomas; Riedel, Gernot
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
74
Thermo mechanical Reliability of Low-temperature Low-pressure Die Bonding Using Thin Ag Flake Pastes
Authors:
Sakamoto, Soichi; Suganuma, Katuaki
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
75
Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique
Authors:
Li, Jiping; Ngo, Khai D. T.; Lu, Guo-Quan; Xie, Huikai
Conference:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems