41
Low Surface Roughness Epic™ D2xx soft pads for CMP Applications
Authors:
Nair, Jay; Lu, Shaoning; Page, Joseph; Bigoin, Gilles; Sun, Fred; Gaudet, Greg
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
42
Microreplicated Pad Conditioner for Copper Barrier CMP Applications
Authors:
Zabasajja, John; Le-huu, Duy; Gould, Charles
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
43
Oxide Rate and Selectivity as a Function of Pad Chemistry,
Authors:
Renteln, Peter; Hsu, Oscar
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
44
Particle Reduction in W-CMP Process through Optimizing Post Cleaner
Authors:
Kim, Nam Yun; Kim, Kuen Byul; Jang, Young Seok; Lee, Jae Chang; Hong, Jin Suk; Baek, Kye Hyun; Kim, Hee Seok; Cho, Han Ku
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
45
Performance of a Novel Slurry Injection System on an Ebara F-REX200® Polisher for a Silicon Dioxide CMP Application
Authors:
Borucki, Leonard; Zhuang, Yun; Sampurno, Yasa; Philipossian, Ara; Kreutzer-Schneeweiss, Sascha
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
46
Planarization Efficiency of Copper Protrusion
Authors:
Lin, Jie; Poutasse, Charles A.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
47
Process Optimization of Grinding and CMP for Thinning of Si
Authors:
Feeney, Paul; Shumway, Lynn
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
48
Processing Properties of Strong Oxidizing Slurry and Effect of Processing Atmosphere in SiC-CMP
Authors:
Yin, Tao; Doi, Toshiro; Kurokawa, Syuhei; Ohnishi, Osamu; Yamazaki, Tsutomu; Wang, Zhida; Tan, Zhe
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
49
Reduction of Edge Exclusion by EPC ring in CMP process
Authors:
Park, Yeongbong; Lee, Youngkyun; Yuh, Minjong; Jeong, Haedo
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
50
Relationship between Spatial Wavelength Pad Surface Profile and Pattern Step-height Reduction with 28 nm Ceria Particle Slurry
Authors:
Moon, Jinok; Bae, Jae-Young; Seo, Jihoon; Paik, Ungyu
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
51
Research on the controlling technology of deliquescent action in polishing of KDP crystals based on deliquescent action
Authors:
Guo, Shaolong; Zhang, Feihu; Zhang, Yong
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
52
Role of Abrasive Type and Media Surface Energy on Nanoparticle Adsorption
Authors:
Kaiser, Jordan; Streit, Michael; Connor, Patrick; Levy, Patrick; Keleher, Jason J.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
53
Scratch Reduction by using Nano-colloidal Ceria Slurry with Multiselectivity of SiO2/Si3N4/Poly-Si Films in STI-CMP
Authors:
Kang, Hyun-Goo; Koh, Jeong-Deog; Han, Seung-Woo; Lee, Jin Won; Lee, Byoun-Gki; Pyi, Seung- Ho; Lee, Byung-Seok; Kim, Jin-Woong; Reiss, Brian; Jeong, Jae-Deok; Nam, Chul-Woo; Jang, Ju-Yeon; Choi, Kyo-Se; Dysard, Jeffrey; Woodland, Daniel
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
54
Slurry Abrasive Particle Agglomeration Experimentation and Modeling for Chemical Mechanical Planarization (CMP)
Authors:
Johnson, Joy M.; Boning, Duane S.; Kim, Gwang-Soo; Safier, Paul; Knutson, Karson
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
55
Slurry Development for Copper/Barrier CMP
Authors:
Zhang, Baoguo; Liu, Yuling
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
56
Slurry selectivity influence on STI and POP processes for RMG application
Authors:
Euvrard, C.; Perrot, C.; Seignard, A.; Dettoni, F.; Rivoire, M.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
57
Smart pad dressing for double-side polishing
Authors:
Kanzow, J.; Werth, S.; Mörsch, G.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
58
STI CMP stop in Silicon Nitride controlled by FullVision™ endpoint
Authors:
Perrot, C.; Pitard, F.; Cui, S.; Lam, G.; Del Medico, S.; Bennett, D.; Gaillard, S.; Hinsinger, O.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
59
Study on fine particle behavior in slurry flow between wafer and polishing pad as a material removal process in CMP
Authors:
Kimura, Keiichi; Suzuki, Keisuke; Khajornrungruang, Panart
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology
60
Study on Polishing Properties for Phase Change Memory
Authors:
Bae, Jinwoo; Lee, Wonjun; Park, Seungho; Lee, Jae-Dong; Hwang, Inseak; Nam, Seok-Woo
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology