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41

Low Surface Roughness Epic™ D2xx soft pads for CMP Applications

Authors:
Nair, Jay; Lu, Shaoning; Page, Joseph; Bigoin, Gilles; Sun, Fred; Gaudet, Greg
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

42

Microreplicated Pad Conditioner for Copper Barrier CMP Applications

Authors:
Zabasajja, John; Le-huu, Duy; Gould, Charles
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

43

Oxide Rate and Selectivity as a Function of Pad Chemistry,

Authors:
Renteln, Peter; Hsu, Oscar
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

44

Particle Reduction in W-CMP Process through Optimizing Post Cleaner

Authors:
Kim, Nam Yun; Kim, Kuen Byul; Jang, Young Seok; Lee, Jae Chang; Hong, Jin Suk; Baek, Kye Hyun; Kim, Hee Seok; Cho, Han Ku
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

45

Performance of a Novel Slurry Injection System on an Ebara F-REX200® Polisher for a Silicon Dioxide CMP Application

Authors:
Borucki, Leonard; Zhuang, Yun; Sampurno, Yasa; Philipossian, Ara; Kreutzer-Schneeweiss, Sascha
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

46

Planarization Efficiency of Copper Protrusion

Authors:
Lin, Jie; Poutasse, Charles A.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

47

Process Optimization of Grinding and CMP for Thinning of Si

Authors:
Feeney, Paul; Shumway, Lynn
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

48

Processing Properties of Strong Oxidizing Slurry and Effect of Processing Atmosphere in SiC-CMP

Authors:
Yin, Tao; Doi, Toshiro; Kurokawa, Syuhei; Ohnishi, Osamu; Yamazaki, Tsutomu; Wang, Zhida; Tan, Zhe
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

49

Reduction of Edge Exclusion by EPC ring in CMP process

Authors:
Park, Yeongbong; Lee, Youngkyun; Yuh, Minjong; Jeong, Haedo
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

50

Relationship between Spatial Wavelength Pad Surface Profile and Pattern Step-height Reduction with 28 nm Ceria Particle Slurry

Authors:
Moon, Jinok; Bae, Jae-Young; Seo, Jihoon; Paik, Ungyu
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

51

Research on the controlling technology of deliquescent action in polishing of KDP crystals based on deliquescent action

Authors:
Guo, Shaolong; Zhang, Feihu; Zhang, Yong
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

52

Role of Abrasive Type and Media Surface Energy on Nanoparticle Adsorption

Authors:
Kaiser, Jordan; Streit, Michael; Connor, Patrick; Levy, Patrick; Keleher, Jason J.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

53

Scratch Reduction by using Nano-colloidal Ceria Slurry with Multiselectivity of SiO2/Si3N4/Poly-Si Films in STI-CMP

Authors:
Kang, Hyun-Goo; Koh, Jeong-Deog; Han, Seung-Woo; Lee, Jin Won; Lee, Byoun-Gki; Pyi, Seung- Ho; Lee, Byung-Seok; Kim, Jin-Woong; Reiss, Brian; Jeong, Jae-Deok; Nam, Chul-Woo; Jang, Ju-Yeon; Choi, Kyo-Se; Dysard, Jeffrey; Woodland, Daniel
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

54

Slurry Abrasive Particle Agglomeration Experimentation and Modeling for Chemical Mechanical Planarization (CMP)

Authors:
Johnson, Joy M.; Boning, Duane S.; Kim, Gwang-Soo; Safier, Paul; Knutson, Karson
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

55

Slurry Development for Copper/Barrier CMP

Authors:
Zhang, Baoguo; Liu, Yuling
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

56

Slurry selectivity influence on STI and POP processes for RMG application

Authors:
Euvrard, C.; Perrot, C.; Seignard, A.; Dettoni, F.; Rivoire, M.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

57

Smart pad dressing for double-side polishing

Authors:
Kanzow, J.; Werth, S.; Mörsch, G.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

58

STI CMP stop in Silicon Nitride controlled by FullVision™ endpoint

Authors:
Perrot, C.; Pitard, F.; Cui, S.; Lam, G.; Del Medico, S.; Bennett, D.; Gaillard, S.; Hinsinger, O.
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

59

Study on fine particle behavior in slurry flow between wafer and polishing pad as a material removal process in CMP

Authors:
Kimura, Keiichi; Suzuki, Keisuke; Khajornrungruang, Panart
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology

60

Study on Polishing Properties for Phase Change Memory

Authors:
Bae, Jinwoo; Lee, Wonjun; Park, Seungho; Lee, Jae-Dong; Hwang, Inseak; Nam, Seok-Woo
Conference:
ICPT 2012 - International Conference on Planarization / CMP Technology