1
Mechanical Reliability of Power Electronic Systems
Authors:
Schriefer, T.; Hofmann, M.
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
2
Metallurgical structure of lead free solder alloy to improve the reliability of power module
Authors:
Tan, K.-L.; Morelle, J.-M.; Vivet, L.; Lavrentieff, S.
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
3
Microstructure and thermophysical characterization of innovative plastic materials for power electronics
Authors:
Klengel, S.; Boettge, B.; Naumann, F.; Mittag, M.; Hirsch, U.; Ehrich, C.
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
4
Monitoring of IGBT modules - temperature and degradation simulation
Authors:
Bonderup Pedersen, Kristian; Brincker, Mads; Ghimire, Pramod; Pedersen, Kjeld
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
5
New Gate Driver Solutions for Modern Power Devices and Topologies
Authors:
Herzer, R.
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
6
Non-Destructive Assessment of Reliability and Quality related Properties of Power Electronic Devices for the In-Line Application of Scanning Acoustic Microscopy
Authors:
Brand, Sebastian; Naumann, Falk; Tismer, Sebastian; Boettge, Bianca; Rudzki, Jacek; Osterwald, Frank; Petzold, Matthias
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
7
Optimal double sided gate control of IGBT for lower turn-off loss and surge voltage suppression
Authors:
Harada, S.; Tsukuda, M.; Tsukuda, M.; Omura, I.
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
8
Optimization of a Gallium Nitride HEMT design for a high frequency DC-DC converter application
Authors:
Cucak, D.; Vasic, M.; Garcia, O.; Oliver, J. A.; Alou, P.; Cobos, J. A.
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
9
Parasitic inductance hindering utilization of power devices
Authors:
Bayerer, Reinhold
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
10
Passive thermal cycling of power diodes under controlled atmospheric conditions - effects on metallization degradation
Authors:
Brincker, Mads; Bonderup Pedersen, Kristian; Kristensen, Peter Kjaer; Popok, Vladimir
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
11
PCB Embedded Power Electronics for Low Voltage Applications
Authors:
Kearney, Daniel; Kicin, Slavo; Bianda, Enea; Krivda, Andrej; Bauman, David
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
12
Photovoltaic Inverters in µ-Scale
Authors:
Mallwitz, Regine; Lippold, Florian
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
13
Potential failure risks causing delamination of sinter joints
Authors:
Boettge, Bianca; Reissaus, Stephan; Klengel, Sandy
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
14
Power Cycling Tests in High Temperature Conditions of SiC-MOSFET Power Modules and Ageing Assessment
Authors:
Ibrahim, A.; Ousten, J. P.; Lallemand, R.; Khatir, Z.
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
15
Power modules for automotive applications with pin-fin substrates fabricated with a special arc welding technology
Authors:
Uhlemann, Andre; Sobkowiak, Marco
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
16
Probabilistic Strength Characterization of Thin Semiconductor Devices for Power Electronic Applications
Authors:
Naumann, F.; Mittag, M.; Bernasch, M.; Petzold, M.
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
17
Process Optimization in Transient Liquid Phase Soldering (TLPS) for an Efficient and Economical Production of High Temperature Power electronics
Authors:
Syed-Khaja, Aarief; Franke, Joerg
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
18
Processing and Properties of Chip-bonding on Copper by Low-temperature Sintering a Nanosilver Paste
Authors:
Zheng, Hanguang; Gao, Shan; Ngo, Khai; Lu, Guo-Quan; Lu, Guo-Quan
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
19
Prospects for advances in power magnetics
Authors:
Sullivan, Charles R.
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
20
Rapid Sintering of Nanosilver Paste Using Current for attaching IGBT Chips
Authors:
Feng, Shuang-Tao; Mei, Yun-Hui; Li, Xin; Lu, Guo-Quan
Conference:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems