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61

Lifetime Testing Method for Ceramic Capacitors for Power Electronics Applications

Authors:
Dresel, Fabian; Tham, Nils; Erlbacher, Tobias; Schletz, Andreas
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

62

Limitation of Power Module Lifetime Derived from Active Power Cycling Tests

Authors:
Scheuermann, Uwe; Junghaenel, Marion
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

63

Low Temperature Silver Sinter Processes on (EN)EPEAg Surfaces for High Temperature SiC Power Modules

Authors:
Blank, Thomas; Ishikawa, Dai; An, Bao Ngoc; Scherer, Torsten; Bruns, Michael; Helber, Jessica; Leyrer, Benjamin; Wurst, Helge; Meisser, Michael; Weber, Marc
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

64

Making Thermal Grease Obsolete: Fully Isolated Discrete Power Package with High Thermal and Electrical Performance

Authors:
Kasztelan, Christian; Basler, Thomas; Schmidt, Matthias; Pedone, Daniel; Fuergut, Edward
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

65

Novel Partial Discharge Location Algorithm for Next Generation Power Module using Small Loop Sensors

Authors:
Maki, Jyunya; Akinaga, Yuya; Kozako, Masahiro; Hikita, Masayuki; Nakamura, Yoko; Taniguchi, Katsumi; Ikeda, Yoshinari; Okamoto, Kenji
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

66

Novel SiC Module Design – Optimised for Low Switching Losses, Efficient Cooling Path and Low Inductance

Authors:
Huber, Thomas; Kleimaier, Alexander
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

67

Novel specimen design to test engineering plastics for power electronic applications

Authors:
Boettge, Bianca; Bernhardt, Rico; Klengel, Sandy; Wels, Sebastian; Claudi, Albert
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

68

On the reliability of stacked metallized ceramic substrates under thermal cycling

Authors:
Mouawad, Bassem; Li, Jianfeng; Castellazzi, Alberto; Johnson, C. Mark
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

69

On-line Virtual Junction Temperature Measurement via DC Gate Current Injection

Authors:
Brandelero, Julio; Ewanchuk, Jeffrey; Mollov, Stefan
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

70

On-time Dependency on the Power Cycling Capability of Al Bond Wires Measured by Shear Test

Authors:
Jiang, Nan; Lutz, Josef; Kalajica, Marko
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

71

Optimizing integrated Common- and Differential-Mode chokes with the PermeabilityLink-method

Authors:
Schliewe, Joern; Koeppen, Matthias; Gauss, August; Lange, Detlef; Weber, Stefan
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

72

Parasitic Extraction Procedures for SiC Power Modules

Authors:
Kovacevic-Badstuebner, Ivana; Stark, Roger; Grossner, Ulrike; Guacci, Mattia; Kolar, Johann W.
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

73

PCB-Embedding for GaN-on-Si Power Devices and ICs

Authors:
Reiner, Richard; Weiss, Beatrix; Meder, Dirk; Waltereit, Patrick; Gerrer, Thomas; Quay, Ruediger; Vockenberger, Christian; Ambacher, Oliver
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

74

Power Chip Interconnections Based on TLP and Sintering of CTEMatched Conductors

Authors:
Feisst, Markus; Schaetzle, Philip; Wilde, Juergen
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

75

Power cycling reliability of time-reduced sintering for attaching SiC diodes using nanosilver film

Authors:
Dai, Jingru; Li, Jianfeng; Agyakwa, Pearl; Johnson, Christopher Mark
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

76

Power Electronic Integration and packaging for aeronautic application in harsh environment

Authors:
Meuret, Regis; Martineau, Donatien; Youssef, Toni; Martin, Christian; Yade, Ousseynou
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

77

Power Loss Analysis of 60 V Trench Field-Plate MOSFETs Utilizing Structure Based Capacitance Model for Automotive Application

Authors:
Kobayashi, Kenya; Sudo, Masaki; Omura, Ichiro
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

78

Pressureless Silver Nanopowder Sintered Bonds for Liquid Cooled IGBT Power Modules

Authors:
Kim, Namjee; Li, Rophina; Machler, Meinrad; Burgers, John; Winkler, Sooky; Ng, Wai Tung
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

79

Pressureless sintering of large dies by infrared radiation

Authors:
Schmitt, Wolfgang; Chew, Ly May; Miller, Robert
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

80

Real-time condition monitoring of IGBT modules in PV inverter systems

Authors:
Choi, Ui-Min; Blaabjerg, Frede
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems