1
Lifetime Testing Method for Ceramic Capacitors for Power Electronics Applications
Authors:
Dresel, Fabian; Tham, Nils; Erlbacher, Tobias; Schletz, Andreas
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
2
Limitation of Power Module Lifetime Derived from Active Power Cycling Tests
Authors:
Scheuermann, Uwe; Junghaenel, Marion
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
3
Low Temperature Silver Sinter Processes on (EN)EPEAg Surfaces for High Temperature SiC Power Modules
Authors:
Blank, Thomas; Ishikawa, Dai; An, Bao Ngoc; Scherer, Torsten; Bruns, Michael; Helber, Jessica; Leyrer, Benjamin; Wurst, Helge; Meisser, Michael; Weber, Marc
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
4
Making Thermal Grease Obsolete: Fully Isolated Discrete Power Package with High Thermal and Electrical Performance
Authors:
Kasztelan, Christian; Basler, Thomas; Schmidt, Matthias; Pedone, Daniel; Fuergut, Edward
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
5
Novel Partial Discharge Location Algorithm for Next Generation Power Module using Small Loop Sensors
Authors:
Maki, Jyunya; Akinaga, Yuya; Kozako, Masahiro; Hikita, Masayuki; Nakamura, Yoko; Taniguchi, Katsumi; Ikeda, Yoshinari; Okamoto, Kenji
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
6
Novel SiC Module Design – Optimised for Low Switching Losses, Efficient Cooling Path and Low Inductance
Authors:
Huber, Thomas; Kleimaier, Alexander
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
7
Novel specimen design to test engineering plastics for power electronic applications
Authors:
Boettge, Bianca; Bernhardt, Rico; Klengel, Sandy; Wels, Sebastian; Claudi, Albert
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
8
On the reliability of stacked metallized ceramic substrates under thermal cycling
Authors:
Mouawad, Bassem; Li, Jianfeng; Castellazzi, Alberto; Johnson, C. Mark
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
9
On-line Virtual Junction Temperature Measurement via DC Gate Current Injection
Authors:
Brandelero, Julio; Ewanchuk, Jeffrey; Mollov, Stefan
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
10
On-time Dependency on the Power Cycling Capability of Al Bond Wires Measured by Shear Test
Authors:
Jiang, Nan; Lutz, Josef; Kalajica, Marko
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
11
Optimizing integrated Common- and Differential-Mode chokes with the PermeabilityLink-method
Authors:
Schliewe, Joern; Koeppen, Matthias; Gauss, August; Lange, Detlef; Weber, Stefan
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
12
Parasitic Extraction Procedures for SiC Power Modules
Authors:
Kovacevic-Badstuebner, Ivana; Stark, Roger; Grossner, Ulrike; Guacci, Mattia; Kolar, Johann W.
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
13
PCB-Embedding for GaN-on-Si Power Devices and ICs
Authors:
Reiner, Richard; Weiss, Beatrix; Meder, Dirk; Waltereit, Patrick; Gerrer, Thomas; Quay, Ruediger; Vockenberger, Christian; Ambacher, Oliver
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
14
Power Chip Interconnections Based on TLP and Sintering of CTEMatched Conductors
Authors:
Feisst, Markus; Schaetzle, Philip; Wilde, Juergen
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
15
Power cycling reliability of time-reduced sintering for attaching SiC diodes using nanosilver film
Authors:
Dai, Jingru; Li, Jianfeng; Agyakwa, Pearl; Johnson, Christopher Mark
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
16
Power Electronic Integration and packaging for aeronautic application in harsh environment
Authors:
Meuret, Regis; Martineau, Donatien; Youssef, Toni; Martin, Christian; Yade, Ousseynou
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
17
Power Loss Analysis of 60 V Trench Field-Plate MOSFETs Utilizing Structure Based Capacitance Model for Automotive Application
Authors:
Kobayashi, Kenya; Sudo, Masaki; Omura, Ichiro
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
18
Pressureless Silver Nanopowder Sintered Bonds for Liquid Cooled IGBT Power Modules
Authors:
Kim, Namjee; Li, Rophina; Machler, Meinrad; Burgers, John; Winkler, Sooky; Ng, Wai Tung
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
19
Pressureless sintering of large dies by infrared radiation
Authors:
Schmitt, Wolfgang; Chew, Ly May; Miller, Robert
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20
Real-time condition monitoring of IGBT modules in PV inverter systems
Authors:
Choi, Ui-Min; Blaabjerg, Frede
Conference:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems