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IEC 60747-1:2006+AMD1:2010 CSV (Consolidated Version)

Semiconductor devices - Part 1: General

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495.00 € 

IEC 60749-19:2003/AMD1:2010

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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10.00 € 

IEC 60749-32:2002/AMD1:2010

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

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10.00 € 

IEC 60191-6-18:2010/COR2:2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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0.00 € 

IEC 60191-6-18:2010/COR1:2010

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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0.00 € 

IEC 62415:2010

Semiconductor devices - Constant current electromigration test

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40.00 € 

IEC 60747-1:2006/AMD1:2010

Amendment 1 - Semiconductor devices - Part 1: General

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10.00 € 

IEC 62418:2010

Semiconductor devices - Metallization stress void test

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115.00 € 

IEC 60191-6-19:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

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80.00 € 

IEC 60747-14-5:2010

Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor

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115.00 € 

IEC 60747-14-1:2010

Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors

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155.00 € 

IEC 60191-6-18:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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115.00 € 

IEC 60191-6:2009

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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249.99 € 

IEC 62007-2:2009

Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods

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249.99 € 

IEC 60747-1:2006/COR1:2008

Corrigendum 1 - Semiconductor devices - Part 1: General

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0.00 € 

IEC 60191-2:1966/AMD17:2008

Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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20.00 € 

IEC 60749-38:2008

Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory

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80.00 € 

IEC 60747-16-2:2001+AMD1:2007 CSV (Consolidated Version)

Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers

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355.00 € 

IEC 60747-16-2:2001/AMD1:2007

Amendment 1 - Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers

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10.00 € 

IEC 60191-2:1966/AMD16:2007

Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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20.00 €