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IEC 60191-6-19:2010Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
75.00 €
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IEC 60747-14-5:2010Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
115.00 €
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IEC 60747-14-1:2010Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
150.00 €
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IEC 60191-6-18:2010Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
115.00 €
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IEC 60191-6:2009Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
220.00 €
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IEC 62007-2:2009Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods
220.00 €
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IEC 60191-2:1966/AMD17:2008Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
20.00 €
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IEC 60749-38:2008Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
75.00 €
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IEC 60747-16-2:2001+AMD1:2007 CSV (Consolidated Version)Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
249.99 €
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IEC 60747-16-2:2001/AMD1:2007Amendment 1 - Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
10.00 €
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IEC 60191-2:1966/AMD16:2007Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
20.00 €
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IEC 60191-6-16:2007Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
40.00 €
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IEC 60749-35:2006Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
150.00 €
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IEC 60749-27:2006Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
75.00 €
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IEC 60191-2:1966/AMD13:2006Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
75.00 €
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IEC 60191-2:1966/AMD14:2006Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
40.00 €
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IEC 60191-2:1966/AMD15:2006Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
20.00 €
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IEC 60191-2:1966/AMD12:2006Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
20.00 €
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