IEC TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
Circulation Date:
2014-05
Edition:
1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 187 VDE Artno.: 220795
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.